Peltier chip innerds: Each ship has 127 pairs of Bismuth Telluride pairs. The pairs of P/N pellets are configured so that they are connected electrically in series, but thermally in parallel. Metalized ceramic substrates provide the platform for the pellets and the small conductive tabs that connect them. The pellets, tabs and substrates thus form a layered configuration. Module size is 40 mm x 40 mm.